With the increase in power density of semiconductor devices, "heat dissipation" has become the primary issue that hinders the performance and life of electronic equipment. According to statistics, every time the temperature of an electronic device increases by 10 ° C-15 ° C, its corresponding service life will be reduced by 50%. Therefore, the development of high-performance thermal interface materials for high power density thermal management is particularly important.
Recently, the functional carbon material team and collaborators of the Surface Division of the Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences have prepared a high-performance thermal interface material based on graphene paper. The preparation process of this material is shown in Figure 1a: First, the nano-silica particles (SiO2 NPs) were modified on the surface of graphene oxide (GO) by hydrolysis of ethyl orthosilicate (TEOS) in a weakly alkaline environment; then The obtained GO / SiO2 NPs are mixed with graphene powder, and a composite graphene film is prepared by suction filtration, so that nano-scale silicon sources (SiO2 NPs) are evenly distributed between the graphene layers; finally, the composite graphene film After rapid heat treatment, the silicon source is converted into silicon carbide nanowires in situ to obtain a graphene hybrid paper (GHP) with a silicon carbide-graphene double structure, and its cross-sectional structure is shown in FIG. 1b.
Since the silicon carbide nanowires connected between the graphene layers form a longitudinal thermal conduction path, the longitudinal thermal conductivity of GHP (10.9W / mK) is increased by 60% compared to graphene paper (GP, 6.8W / mK). In addition, as shown in Figure 1c, under 75psi compressive stress, the longitudinal thermal conductivity of GHP under compression is further improved to 17.6W / mK, which is higher than that of traditional graphene paper and most commercial thermal interface materials, including Thermally conductive silicone pads, thermally conductive silicone grease, thermally conductive gel, etc. (Figure 1d).
In the actual thermal interface performance evaluation experiment, the temperature drop of the system using GHP as the thermal interface material is as high as 18.3 ℃, which exceeds twice the temperature drop of the commercial thermal interface material (8.9 ℃), and the heat dissipation efficiency is improved by 27.3%. The experimental results are as follows As shown in Figure 2a-c. Figure 2d-e is the simulation of the heat dissipation process by the CFD simulation software. The results show that GHP not only has a higher longitudinal thermal conductivity, but its contact thermal resistance is also lower than mainstream commercial thermal pads. In addition, compared to silica gel-based commercial thermal interface materials, GHP is entirely composed of inorganic silicon carbide and graphene, with better thermal stability and environmental adaptability. The related work has been published in ACS Nano (2019, DOI: 10.1021 / acsnano.8b07337).
The research work was supported by the National Key R & D Program (2017YFB0406000), the Chinese Academy of Sciences Equipment (YZ201640), the Ningbo Special Project (2016S1002 and 2016B10038), and the Ningbo International Cooperation (2017D10016).
Figure 1 GHP preparation process and related structure and performance characterization
Figure 2 GHP thermal interface performance test and simulation
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