- Model NO.: Hailong NdFeB Magnets
- Shape: Customized
- Grade: N35
- Composition: Neodymium Iron Boron
- Trademark: Hailong
- Specification: Customized
- HS Code: 8505110000
- Application: Electronic Products, Motor Magnet, Wind Turbine Magnet
- Coating: Nickel
- Working Tepmerature: 80-220 Degree Centigrade
- Shapes: Customized Like Disc, Cylinder, Block, Ring, etc.
- Transport Package: Plastic Bag+Paper Carton+Wooden Pallet
- Origin: Jiangsu, China
Permanent NdFeB MAGNET
Neodymium-Iron-Boron Magnet
Material: |  Neodymium Iron Boron (NdFeB) Magnet , Permanent Magnet |
Supplier: | Â Nantong Hailong Magnetic Material Co., Ltd. |
HS Code: | Â 8505111000 |
Advantage: | Â Strong magnet power, Small Size for installation |
Disadvantage: | Â Low Curie Temperature, Low Corrosion Resistance |
Plating Protection: | Â Nickel , Tin, Zinc, Copper, Gold and so on |
size: | Â Depends on the detail dimension requirements of the customer |
Shape: | Â Round, Block, Ring, Arc, and Other Special Shapes |
Grade: | Â N35-N52, N35M-N52M, N30H-N50H, N30SH-N45SH, N28UH- 42UH, N28EH-N38EH |
Certification: | Â ISO 9001: 2008, ROHS, SGS |
Magnet Life: | Â Permanent under good condition |
Part B; Production Progress
Part C: Material Grade
Grade | Remanence | Coercive Force | Magnetic Energy | Working Temp | |||||
Br | Hcb | Hcj | (BH) max | Maximum | |||||
KG | T | KOe | KA/m | KOe | KA/m | MGOe | KJ/m3 | ºC | |
N35 | 11.8 | 1.18 | 10.8 | 860 | 12 | 960 | 33~37 | 263~295 | 80 |
N38 | 12.3 | 1.23 | 10.8 | 860 | 12 | 960 | 36~39 | 287~310 | 80 |
N40 | 12.7 | 1.27 | 10.8 | 860 | 12 | 960 | 38~41 | 302~327 | 80 |
N42 | 13.0 | 1.30 | 10.8 | 860 | 12 | 960 | 40~43 | 320~343 | 80 |
N45 | 13.3 | 1.33 | 10.8 | 860 | 12 | 960 | 42~46 | 335~366 | 80 |
N48 | 13.7 | 1.37 | 10.5 | 836 | 11 | 876 | 46~49 | 366~390 | 80 |
N50 | 14.0 | 1.40 | 10.5 | 836 | 11 | 876 | 48~51 | 380~406 | 80 |
N52 | 14.3 | 1.43 | 10.5 | 836 | 11 | 876 | 49~53 | 390~422 | 80 |
 | |||||||||
N35M | 11.8 | 1.18 | 10.8 | 860 | 14 | 1114 | 33~37 | 263~295 | 100 |
N38M | 12.3 | 1.23 | 11.6 | 915 | 14 | 1114 | 36~39 | 287~310 | 100 |
N40M | 12.7 | 1.27 | 11.8 | 939 | 14 | 1114 | 38~41 | 302~327 | 100 |
N42M | 13.0 | 1.30 | 12.0 | 955 | 14 | 1114 | 40~43 | 320~343 | 100 |
N45M | 13.3 | 1.33 | 12.5 | 994 | 14 | 1114 | 42~46 | 335~366 | 100 |
N48M | 13.6 | 1.36 | 12.8 | 1018 | 14 | 1114 | 46~49 | 366~390 | 100 |
N50M | 14.0 | 1.40 | 13.1 | 1042 | 14 | 1114 | 48~51 | 380~406 | 100 |
 | |||||||||
N30H | 10.8 | 1.08 | 10.0 | 795 | 17 | 1350 | 28~35 | 223~255 | 120 |
N33H | 11.4 | 1.14 | 10.6 | 844 | 17 | 1350 | 31~35 | 247~279 | 120 |
N35H | 11.8 | 1.18 | 11.0 | 876 | 17 | 1350 | 33~37 | 263~295 | 120 |
N38H | 12.3 | 1.23 | 11.6 | 915 | 17 | 1350 | 36~39 | 287~310 | 120 |
N40H | 12.7 | 1.27 | 11.8 | 939 | 17 | 1350 | 38~41 | 302~327 | 120 |
N42H | 13.0 | 1.30 | 12.0 | 955 | 17 | 1350 | 40~43 | 320~343 | 120 |
N45H | 13.3 | 1.33 | 12.5 | 994 | 17 | 1350 | 42~46 | 335~366 | 120 |
N48H | 13.6 | 1.36 | 12.8 | 1018 | 17 | 1350 | 46~49 | 366~390 | 120 |
N50H | 14.0 | 1.40 | 13.1 | 1042 | 17 | 1350 | 48~51 | 380~406 | 120 |
 | |||||||||
N30SH | 10.8 | 10.80 | 10.0 | 795 | 20 | 1600 | 28~32 | 223~255 | 150 |
N33SH | 11.4 | 1.14 | 10.6 | 844 | 20 | 1600 | 31~35 | 247~279 | 150 |
N35SH | 11.8 | 1.18 | 11.0 | 876 | 20 | 1600 | 33~37 | 263~295 | 150 |
N38SH | 12.3 | 1.23 | 11.6 | 915 | 20 | 1600 | 36~39 | 287~310 | 150 |
N40SH | 12.7 | 1.27 | 11.8 | 939 | 20 | 1600 | 38~41 | 302~327 | 150 |
N42SH | 13.0 | 1.30 | 12.0 | 955 | 20 | 1600 | 40~43 | 320~343 | 150 |
N45SH | 13.3 | 1.33 | 12.5 | 994 | 20 | 1600 | 42~46 | 335~366 | 150 |
 | |||||||||
N28UH | 10.4 | 1.04 | 9.5 | 756 | 25 | 2000 | 26~29 | 207~231 | 180 |
N30UH | 10.8 | 1.08 | 10.0 | 795 | 25 | 2000 | 28~32 | 223~255 | 180 |
N33UH | 11.4 < Diamond Wire For Semiconductor Material Cutting
Diamond Wire for Semiconductor material cutting: diamond cutting wire is formed by uniformly consolidating diamond powder particles with a Mohs hardness of 10 on a high-strength steel wire substrate with a certain distribution density through a certain method. Originally used in sapphire cutting. Since 2010, diamond wire has been used in photovoltaic crystalline silicon wafer cutting, semiconductor material cutting, graphite cutting, jade cutting, magnetic material cutting, etc. Diamond Wire For Semiconductor Material Cutting,Semiconductor Material Cutting,Semiconductor Material Cutting Wire,Diamond Wire For Semiconductor Material Jiangyin Baoneng Precision New Material Co.,LTD , https://www.baonengwire.com |